Position Overview:

We are seeking a Board Level Multi-Physical System Engineer to join our team in Grenoble. This role involves exploring advanced technologies in electromagnetic, thermo-mechanical, and physicochemical simulation modeling for complex modules, particularly focusing on their interfaces and utilizing in-situ non-destructive testing methods.

Key Responsibilities

• Investigate and develop new technologies related to electromagnetic, thermo-mechanical, and physicochemical field simulations of complex modules, with a special focus on interfaces such as BLT/TIM and underfill, employing in-situ non-destructive technologies.
• Offer technical insights into emerging technology trends and integrate them into client hardware products.
• Collaborate with local and Chinese teams to address upcoming challenges, contributing to the preparation of specifications and design documentation.

Essential Skills and Experience

• In-depth knowledge of microelectronics packaging, module substrate processes, and overall module processing. Must be capable of independently conducting multi-physical field and multi-scale simulations and modeling for complex module packaging.
• Proficient in multi-scale and multi-physical field simulation modeling across electrical, magnetic, thermal, and mechanical domains. Familiarity with reliability packaging challenges, including warpage, stress management, thermo-migration, electro-migration, and heat dissipation.
• Solid understanding of material properties for key layers such as PCB, TIM, substrate, and underfill, along with their implications for overall integration.
• Significant experience with industrial simulation software like COMSOL or HFSS. Knowledge of Python programming is a plus.
• Ability to work effectively both in teams and independently, with strong communication skills for collaborating within a diverse team.
• Must be eligible to work in the European Union for this position.
• Fluency in English is essential.

Benefits

• A dynamic work environment with opportunities to explore and implement cutting-edge technologies.
• Collaboration with international teams and contributions to significant projects in microelectronics.
• Professional growth and development within an innovative company.
• Competitive salary and benefits package.

If you thrive in integrating multi-disciplinary technologies and have a passion for system engineering, we encourage you to apply. Click 'Apply Now' to forward your CV and a cover letter highlighting your experience and enthusiasm for multi-physical system design.

Commitment to Diversity and Inclusion

Our company is unwavering in its commitment to creating a diverse and inclusive environment. We welcome applications from individuals of all genders, ethnicities, and abilities, recognizing that diversity enriches our team and our work.