Position Overview:

We are seeking a Principal Engineer to join our team in Grenoble. This role will focus on investigating and developing advanced technologies in electromagnetic, thermo-mechanical, and physicochemical simulation modeling for complex modules, particularly at their interfaces. The position will also involve utilizing in-situ non-destructive testing technologies.

Leading Engineering Projects

• Research and explore innovative technologies related to electromagnetic, thermo-mechanical, and physicochemical simulation modeling of complex modules, especially focusing on interfaces like BLT/TIM and underfill, employing in-situ non-destructive techniques.
• Provide technical insights into emerging technology trends and apply these insights to enhance client hardware products.
• Collaborate with local and Chinese teams to tackle upcoming challenges and assist in the preparation of specifications and design documents.

Essential Skills and Experience

• Extensive knowledge of microelectronics packaging, module substrate processes, and overall module processing, with the ability to independently conduct multi-physical field and multi-scale simulations and modeling for complex module packaging.
• Proficient in multi-scale and multi-physical field simulation modeling in electrical, magnetic, thermal, and mechanical domains, with a solid understanding of reliability packaging challenges such as warpage, stress management, thermo-migration, electro-migration, and heat dissipation.
• Strong understanding of material properties for essential layers like PCB, TIM, substrate, and underfill, along with their implications for overall integration.
• Significant experience with industrial simulation software such as COMSOL or HFSS; familiarity with Python coding is a plus.
• Ability to work effectively both in teams and independently, along with strong communication skills for collaborating within a diverse group.
• Must be eligible to work in the European Union for this position.
• Fluency in English is required.

Benefits

• An opportunity to work on innovative projects and technologies in a dynamic environment.
• Collaboration with international teams to address significant challenges in microelectronics.
• Professional development and growth within an industry-leading company.
• Competitive salary and comprehensive benefits package.

If you are a visionary engineer with a passion for technological advancement and team leadership, we invite you to apply. Click 'Apply Now' to submit your CV and a cover letter showcasing your expertise and eagerness to lead pioneering engineering projects.

Commitment to Diversity and Inclusion

Our company is dedicated to promoting a diverse and inclusive workplace. We encourage applications from individuals of all genders, ethnicities, and backgrounds. Diversity not only enriches our team but also propels our innovation and success.